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High-Speed FPGA xilinx XCVU13P-2FHGB2104I for 5G and Data Centers
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xilinx XCVU13P-2FHGB2104I
High-performance FPGA for demanding compute and communication tasks
| Brand | xilinx |
| Model | XCVU13P-2FHGB2104I |
| Voltage | 0.9V to 1.0V |
| Country of Origin | United States |
| Weight | 200 g |
| Dimensions | 210 x 210 x 10 mm |
| Warranty | 6 months |
| Certifications | RoHS, CE, FCC |
| SKU / MPN | XCVU13P-2FHGB2104I |
| What’s in the box | FPGA unit, development board, documentation |
| Logic Cells | 3.9 million |
| Block RAM | 2,880 Kb |
| DSP Slices | 1,920 |
| Transceivers | 32 x 28.02 Gb/s |
| Max Speed Grade | -2 |
| Package Type | Flip-Chip Ball Grid Array |
Key benefits: Ultra-high bandwidth, low power consumption, advanced security features, scalable architecture
Typical applications: Data center acceleration, 5G wireless, aerospace and defense, test and measurement
Lifecycle: Active product, 7+ years availability
1 review for High-Speed FPGA xilinx XCVU13P-2FHGB2104I for 5G and Data Centers
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Fast delivery and well packed. The servo drive performs exactly as specified.